BU400Z-178-HT
CONN IC DIP SOCKET 40POS GOLD

From On Shore Technology Inc.

CategoryConnectors, Interconnects
Contact Finish - MatingGold
Contact Finish - PostCopper
Contact Finish Thickness - Mating78.7µin (2.00µm)
Contact Finish Thickness - PostFlash
Contact Material - MatingBeryllium Copper
Contact Material - PostBrass
Contact Resistance7 mOhm
Current Rating1A
DatasheetsBU-xx0Z-178HT Drawing
FamilySockets for ICs, Transistors
FeaturesOpen Frame
Housing MaterialPolybutylene Terephthalate (PBT), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeSurface Mount
Number of Positions or Pins (Grid)40 (2 x 20)
Online CatalogBU-178HT Series
Operating Temperature-55°C ~ 125°C
Other NamesBU400Z178HT ED2211
PackagingTube
Pitch - Mating0.100" (2.54mm)
Pitch - Post0.100" (2.54mm)
Product PhotosBU400Z-178-HT
SeriesBU-178HT
Standard Package10
TerminationSolder
Termination Post Length0.060" (1.50mm)
TypeDIP, 0.6" (15.24mm) Row Spacing

External links